Post dicing cleaning

SCS112 Model – Semi-automatic cleaning system

The SCS112 Model isa semi-automatic machine, specially designed for cleaning wafers after dicing or scribing.

This system cleans wafers mounted on film or media propelling DI water with high-pressure jet or via an atomising nozzle.

A rapid drying cycle follows using  high speed rotation, N₂ or an infrared lamp.

The system is compatible with the 200 mm wafers.