WET CLEANING MACHINE WITH HIGH PRESSURE JET & BRUSH – UtE

Ultra-t Equipment designs and manufactures manual single and buse double sided cleaning equipment, for the microelectronics and semiconductor industry. 

Effective cleaning is an important necessary step in a manufacturing process. Specialised in glass plate cleaning (Masks) silicon wafer (wafer), photovoltaic cell and substrates (glass, silica, etc …), Ultra-t Equipment uses appropriate technology with various methods such as single/double-sided high pressure DI water nozzle, fog nozzles, megasonic transducer, cleaning brush (nylon or PVA) with or without injection of diluted chemicals.

SCSE : Single Side Cleaning

SCSe series offer an ideal solution for submicron cleaning of photo masks, wafers and various type of substrates (glass, quartz, etc ..). The equipment can be configured with different cleaning options such as high-pressure nozzle, megasonic transducers, brush (nylon or PVA), nozzles for spraying chemicals or DI heated water. It is also possible to set up different types of holders for the parts, chuck for single or multiple substrates simultaneously. Equipment (depending on model) are compatible with substrates of 300mm up to 500mm diameter.

  1. Spindle
  2. Fixed position Nitrogen Blow-off
  3. High pressure nozzle
  4. Oscillating High pressure Spray Arm
  5. Brush
  6.  Megasonic oscillating arm
  7. Infra-Red lamp
  8. Radial Down-draft Exhaust/Drain
  9. Chamber Liner
  10. Brush height adjustment
Nettoyage simple face serie scse

Chuck porte substrats

Example of Chuck carrier substrates

Brosse d’agitation des liquides

Liquid agitation brush

Système de préchauffage

Preheating system

 Vannes produits

Products valves

DCSE : Double Side Cleaning

DCSE Series Models offer an ideal solution for sub-micron double side cleaning of  masks, wafers and various substrates (glass, quartz, etc ..). The equipment can be configured with different cleaning options such as dual high pressure nozzle, double megasonic transducer, double brush (nylon or PVA), nozzles for spraying chemicals or heated DI water. It is also possible to set up different types of chucks for unique multiple substrates simultaneously. Equipment is compatible (depending on model) with  300mm up to 730mm substrate diameter.

  1. Spindle (Shown with chuck)
  2. Oscillating high pressure cleaning arm
  3. Oscillating Nitrogen drying arm
  4. Double side brush arm
  5. Chamber rinse nozzle  (Option)
  6. Heated DI water nozzle
  7. Megasonic low pressure nozzle.

 

Nettoyage double face schéma

Peritest is the Ultra-t representative for France.