Ultra-t Equipment designs and manufactures manual single and buse double sided cleaning equipment, for the microelectronics and semiconductor industry.
Effective cleaning is an important necessary step in a manufacturing process. Specialised in glass plate cleaning (Masks) silicon wafer (wafer), photovoltaic cell and substrates (glass, silica, etc …), Ultra-t Equipment uses appropriate technology with various methods such as single/double-sided high pressure DI water nozzle, fog nozzles, megasonic transducer, cleaning brush (nylon or PVA) with or without injection of diluted chemicals.
SCSe series offer an ideal solution for submicron cleaning of photo masks, wafers and various type of substrates (glass, quartz, etc ..). The equipment can be configured with different cleaning options such as high-pressure nozzle, megasonic transducers, brush (nylon or PVA), nozzles for spraying chemicals or DI heated water. It is also possible to set up different types of holders for the parts, chuck for single or multiple substrates simultaneously. Equipment (depending on model) are compatible with substrates of 300mm up to 500mm diameter.
Example of Chuck carrier substrates
Liquid agitation brush
Preheating system
Products valves
DCSE Series Models offer an ideal solution for sub-micron double side cleaning of masks, wafers and various substrates (glass, quartz, etc ..). The equipment can be configured with different cleaning options such as dual high pressure nozzle, double megasonic transducer, double brush (nylon or PVA), nozzles for spraying chemicals or heated DI water. It is also possible to set up different types of chucks for unique multiple substrates simultaneously. Equipment is compatible (depending on model) with 300mm up to 730mm substrate diameter.
Peritest is ULTRA-T representative for France & Southern Europe
